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Mechanical Engineer Salary in Semiconductor
Semiconductor pays mechanical engineers a median of $118,930 per year. The sector employs roughly 18,700 MEs across fabs (Intel, TSMC, Samsung, Micron, GlobalFoundries) and equipment vendors (Applied Materials, Lam Research, KLA). CHIPS Act funding has lifted pay bands 8 to 15 percent since 2023.
Data as of May 2026, sourced from BLS OES May 2024 (SOC 17-2141).
Semiconductor Median
$118,930
vs national $102,320 (+16.2%)
Sector Employment
18,700
MEs in computer and electronic product mfg
CHIPS Act Impact
+8-15%
wage inflation since 2023
A CHIPS Act-driven hiring cycle
The Bureau of Labor Statistics Occupational Employment and Wage Statistics tables for SOC 17-2141 within NAICS 3344 (Semiconductor and Other Electronic Component Manufacturing), May 2024 release, report a semiconductor-industry mechanical engineer median of $118,930 and mean of $121,400 for roughly 18,700 employed engineers.
The semiconductor sector pays MEs 16.2 percent above the national median, with equipment-vendor roles paying more than fab-floor roles. The pay premium has accelerated since the passage of the CHIPS and Science Act of 2022 (Public Law 117-167), which authorized $52.7 billion in federal investment in US semiconductor manufacturing. Intel announced fabs in Arizona (Fab 52 and Fab 62) and Ohio (Ohio One). TSMC committed $40 billion to its Arizona campus. Samsung committed $17 billion to a Taylor TX expansion. Micron announced a $100 billion fab cluster in Clay NY (the largest single private-sector investment in US history). GlobalFoundries expanded its Malta NY foundry. The simultaneous hiring pressure across these projects has lifted ME pay bands by an estimated 8 to 15 percent year-over-year since 2023, with Phoenix and Austin seeing the most acute wage inflation.
Per-employer pay bands
| Employer | Median Base |
|---|---|
| Intel | $132,000 |
| TSMC Arizona | $128,000 |
| Samsung Austin | $124,000 |
| Applied Materials | $138,000 |
| Lam Research | $134,000 |
| KLA Corp | $132,000 |
| Micron Technology | $116,000 |
| GlobalFoundries | $115,000 |
Equipment vendors (Applied Materials, Lam Research, KLA) pay more than fabs themselves because their work is more like consumer-electronics hardware design (precision motion, vacuum systems, thermal management, robotics) and their RSU programs are aggressive relative to base. Fab-floor MEs work on facilities, process equipment integration, and yield improvement, with lower base pay but stronger bonus structures tied to fab yield metrics.
Geography: the new semiconductor map
US semiconductor ME employment is undergoing the largest geographic redistribution in the industry's history. Historically concentrated in Silicon Valley, Hillsboro OR, Albuquerque NM, Boise ID, and Austin TX, the sector is now adding major new clusters in Phoenix AZ (Intel + TSMC), Columbus OH (Intel Ohio One), Taylor TX (Samsung), and Clay NY (Micron). Phoenix alone has announced ME hiring through 2030 exceeding 6,000 positions across Intel and TSMC combined. The CHIPS Act bonus incentives for advanced packaging and R&D will likely spawn another wave of secondary investment from suppliers (Applied Materials, Lam, ASML) co-locating near the new fabs.
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Related pages
All Industries
Parent hub: every industry's pay band, ranked.
Arizona
Phoenix Intel + TSMC, the largest CHIPS Act hiring cluster.
Texas
Austin and Taylor Samsung expansion.
Thermal Engineer
Thermal management specialists, paid premium at equipment vendors.
California
Bay Area equipment-vendor HQs.
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